HDI Printed Circuit Boards for Smaller, Faster, Extremely
Reliable Products
Sprintpcb manufactures and assembles high-density interconnect PCBs with blind, buried, and micro-vias, built-up
laminations, and the highest signal integrity in the industry.
The cost-effectiveness of the appropriate HDI layout may surprise you.
By carefully planning the stack-up, you can reduce the expenses associated with HDI PCBs. Moreover, the efficient design in HDI production can lead to faster time-to-market. Additionally, microvias are known to outperform traditional through-holes in terms of reliability.
If you're ready to begin working with HDI PCBs, Sprintpcb's team of engineers can assist you in efficiently prototyping and manufacturing your HDI PCBs.
Sprintpcb manufactures your HDI PCBs with full intellectual property protection.
High tech in small form:
- Special stack-up help / NPI review
- Up to 30 layers
- Files evaluated by engineers
- Quote sent by email within a few hours
HDI features:
- Down to 1.5-mil trace space, 2-mil holes
- Blind vias, buried vias, and other microvia techniques
- Built-up laminations and high-signal performance considerations
- Laser direct imaging
- Fine lines and via-in-pad technology
- Metal-core
- Flex / rigid-flex
Feature | Technical specification |
|---|---|
Number of layers | 4 – 22 layers standard, 30 layers advanced |
Technology highlights | Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads. |
HDI builds | 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D |
Materials | FR4 standard, FR4 high performance, Halogen free FR4, Rogers |
Copper weights (finished) | 18μm – 70μm |
Minimum track and gap | 0.075mm / 0.075mm |
PCB thickness | 0.40mm – 3.20mm |
Maxmimum dimensions | 610mm x 450mm; dependant upon laser drilling machine |
Surface finishes available | OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers |
Minimum mechanical drill | 0.15mm |
Minimum laser drill | 0.10mm standard, 0.075mm advanced |
Trusted by innovators
Engineers and PCB designers at the world's most innovative companies choose Sprintpcb for the highest quality one-stop PCB assembly services, right here in China.
FAQ about HDI PCBs
IPC-2226 defines HDI as a printed circuit board with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces ≤ 100 µm / 0.10 mm, smaller vias (<150 µm) and capture pads <400 µm / 0.40 mm, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology.
At some level of circuit complexity, turning to an architecture with blind and buried vias will result in better yield and lower cost than would a through-hole design.
HDI PCBs help reduce costs by decreasing size, minimizing the number of components, reducing signal interference, and automating the manufacturing process.
Materials play a large role in terms of manufacturability and direct cost of your circuit board. Here is a tip: The goal is always to select the right material for manufacturability that, at the same time, meets your temperature, and your electrical requirements. When it comes to materials, make sure that your high-speed material is also suitable for your HDI design. They are many other factors that come into play when selecting the proper materials for your design. View more.
It is very safe to assume it is +/- 1 mil accuracy. Usually, in a staggered microvia formation, the diameters of both operate and lower microvias are the same. The key parameter that decides whether the staggering is possible or not, without the lower microvia needing to be filled, is the dimension E, the vertical separation between the central access of the two microvias. For staggering to be viable, the value of E must be greater than the microvia diameter.
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