Mixed Laminate Multilayer PCBs
Consisting of multiple laminates and differing dielectric constants, this multilayer (displayed above) is a mixed-dielectric printed circuit board.
Mixed Laminate Multilayer PCBs
Mixed laminate multilayer PCBs are ideal for complex and high-speed circuit designs that require different dielectric constants. They are composed of multiple layers of different laminates, allowing for precise control of impedance, signal integrity, and heat dissipation. The different layers of mixed laminate multilayer PCBs can be interconnected using vias and buried vias, providing a high degree of routing flexibility.
Feature | Technical specification |
|---|---|
Number of layers | 4 – 16 layers |
Technology highlights | special materials, laminating ofmixed medium, fine lines |
Materials | FR4, Rogers4350B, PTEE |
Profile method | Laser cutting, punching, rout |
Copper weights (finished) | 18μm – 70μm |
Minimum track and gap | 0.075mm / 0.075mm |
PCB thickness | 0.05mm – 0.80mm |
Maxmimum dimensions | 450mm x 610mm |
Surface finishes available | OSP, ENIG, Immersion tin, Electrolytic gold, Gold fingers |
Minimum mechanical drill | 0.2mm |
FAQ about Mixed Laminate Multilayer PCBs
A Mixed Laminate Multilayer PCB is a type of printed circuit board that combines multiple layers of different materials in its laminate structure, providing improved electrical and mechanical performance.
The advantages of Mixed Laminate Multilayer PCBs include improved thermal management, increased electrical performance, reduced weight and improved dimensional stability.
Mixed Laminate Multilayer PCBs are manufactured by laminating layers of different materials such as metal-based substrates, ceramic-based materials, and FR-4, and then drilling and plating vias to interconnect the layers.
Mixed Laminate Multilayer PCBs are widely used in demanding applications such as telecommunications, industrial controls, medical devices, and military and aerospace systems.
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