The fully automatic solder paste brushing machine precisely applies solder paste to the designated area of the PCB before placing components. The SprintPCB's full-automatic solder paste printing machine, boasting printing accuracy of ±0.025mm and repeat printing accuracy of ±0.01mm, ensures exceptional precision in depositing solder paste onto the PCB pads. This precision is essential for achieving optimal solder joint quality, ensuring reliable electrical connections between components and the PCB. Additionally, the machine's high repeatability ensures consistent solder paste deposition across multiple PCBs, contributing to overall manufacturing consistency and product reliability.

SPI, abbreviation for 3D Solder Paste Inspection, is mainly used to inspect whether the solder paste printed on the PCB is uniform, full, and without offset. 

Measurement Items: Volume, Area, Height, XY Offset, Shape
Accuracy: XY Resolution: 1um; Height: 0.37um
Minimum Measurement: Rectangle: 150um; Round: 200um
Minimum Pad Spacing: 150um (pad height of 150um as the reference)
PCB Thickness: 0.4-7mm
Maximum PCB Size: L460xW460mm
Detected Defects: Missing Print, Insufficient Solder, Excess Solder, Bridging, Offset, Shape Defects, Surface Contamination

The automatic pick-and-place machine is a device that automatically and precisely mounts surface mount components onto circuit boards, achieving high-speed and high-precision automatic component placement. The parameters of SprintPCB's automatic pick-and-place machine are as follows:

it supports up to 60 types of 8mm components, with sizes ranging from 01005 to 8x8mm and a thickness of 6.5mm for passive components. It can mount components at a speed of up to 36,000 passive components per hour, with each component placed in just 0.1 seconds, and with a placement accuracy of ±0.03mm.

The main feature of a nitrogen reflow oven is the infusion of nitrogen into the furnace chamber to block oxygen from entering, thus preventing oxidation of component leads during reflow soldering. The primary purpose of a nitrogen reflow soldering oven is to enhance soldering quality by conducting the soldering process in an environment with extremely low oxygen content, thereby avoiding component oxidation issues. Additionally, nitrogen reflow soldering ovens can improve solder wetting force, accelerate wetting speed, reduce solder ball formation, prevent bridging, and thus achieve better soldering quality.

AOI (Automated Optical Inspection) functionality is used to inspect circuit boards after components have been mounted. Its operation relies on comparing images and conducting sample analysis. SprintPCB's AOI features a resolution of 15 micrometer pixels, 2 million pixel image capture, and a minimum component test size of 15 micrometers for 0201 chips and ICs with a 0.3mm pitch. It is compatible with PCB sizes ranging from a minimum of 50x50 millimeters to a maximum of 460x330 millimeters, with PCB thickness ranging from 0.3 to 5 millimeters. It can detect various issues including misalignment, insufficient solder, short circuits, contamination, foreign objects, missing components, skewing, tombstoning, inversion, flipping, wrong components, damage, lifted leads, polarity issues, solder bridges, and solder voids.

Compared to traditional wave soldering, fully automatic selective soldering offers the following advantages:
1. Well-designed nozzles enable precise control of the solder height during soldering.
2. Utilization of point-to-point spraying technology ensures more reliable soldering quality.
3. The solder is easily protected by inert gas, reducing waste production.
4. The height of the Z-axis and pump can be adjusted as needed, facilitating soldering tasks on irregular components and complex positions.
5. Linear jetting technology is employed to effectively reduce the usage of auxiliary materials, resulting in cost savings.

X-ray is a commonly used non-destructive testing method, which detects the structure of soldering, circuit wiring, component dimensions, and the thickness of PCBA boards, among others.

It precisely examines soldering points, encapsulation, wiring, and more on PCBs. This includes detecting soldering defects such as voids, short circuits, unwelded or cold soldering, as well as wire breakage, component deformation or damage, inaccurate or tilted component positioning, and thermal deposition.

The main function of UV curing oven is to cure the adhesive coatings on circuit boards.

By instantly curing the coatings, it shortens the coating process time and can also enhance the surface hardness and glossiness of the coatings, making the product appearance more aesthetically pleasing.

It can achieve precise spraying and dripping of liquid materials such as conformal coating and UV adhesive on the surface of products, and even meet the coating requirements of lines, circles, or arcs. After coating, the adhesive cures to form a transparent protective film, effectively protecting the circuit board and equipment from environmental erosion such as dust and humidity. The protective film also ensures the integrity of electronic components, preventing short-circuit problems caused by other impurities and extending the product lifespan.

If circuit boards are stored long-term without vacuum packaging, they may be exposed to moisture from the air. During reflow soldering or wave soldering, this moisture can be heated and vaporized into steam, potentially causing delamination of PCB layers.

The purpose of a drying oven is to remove moisture from the PCB, reducing issues such as poor soldering and decreased insulation caused by water molecules, thereby improving product stability and reliability.

Additionally, the oven can be used for preheating to minimize thermal stress before wave soldering or reflow soldering.

The main function of the offline PCBA cleaning machine is to clean the assembled PCBA after assembly. It can remove surface residues such as flux, solder slag, and dust. After cleaning the surface of the circuit board, the insulation performance will be improved, which helps reduce the occurrence of short circuits, leakage, and other faults between circuit boards.

The offline PCBA cleaning machine adopts advanced cleaning technology, which can clean circuit boards of different sizes and types. It can complete the cleaning work in a short time, saving labor costs.

Dry ice cleaning is an environmentally friendly, chemical-free cleaning method suitable for various surfaces, especially those requiring avoidance of moisture and chemical residues.

Dry ice cleaning utilizes the high-speed impact and sublimation properties of dry ice particles to effectively clean PCB boards, semiconductor chip packaging, including the surfaces of wafers, chips, packaging materials, leads, etc., removing dirt, grease, solder residues, and other impurities.

Moreover, after cleaning, there is no need for secondary cleaning or drying, and no water marks or chemical residues are left behind, ensuring the reliability and quality of the cleaning effect.

The main function is to simulate the aging process of products during long-term use under specific conditions (such as temperature, humidity, voltage, vibration, etc.), and conduct aging tests to accelerate the aging process.

Through this method, the stability, reliability, and durability of products during long-term use are evaluated, thereby reducing the risks of post-sales maintenance costs and product recalls.