PCB Capabilities

Layers count

24

32

60

Minimum board thickness (with solder mask)

0.6mm

0.40mm

0.20mm

Maximum board thickness

4mm

6mm

10mm

Minimum board size

50mm x 50mm

30mm x 30mm

5mm x 5mm

Maximum board size

600mm x 570mm

960mm 600mm

1250mm x 570mm

Minimum line/space innerlayer (depend on copper weight)

3mil/3mil

2.5mil/2.5mil

2mill/2mil

Minimum line/space outerlayer (depend on copper weight)

4mil/4mil

3mil/3mil

2mil/2mil

Surface finish types

OSP, HASL, ENIG, Immersion Silver, Immersion Tin, Hard gold (Connector board)

Hard gold (Selective board) soft gold, ENEPIG

Plus ISIG,EPIG

Mechanical hole size (Finish hole size)

0.2 mm

0.15 mm

0.1 mm

Maximum aspect ratio PTH

10

16

20

Finished tolerance PTH

+/-0.075 mm

+/-0.05 mm

+/-0.025 mm

Finished tolerance NPTH

+/-0.05 mm

+/-0.025 mm

+/-0.015

Epoxy filled through holes (Y/N)

Y

Y

Y

Capped via (Y/N)

Y

Y

Y

Maximum copper weight outerlayer

6 oz

8 oz

10 oz

Maximum copper weight innerlayer

6oz

6oz

>6oz

Control depth drill (Y/N)

Y

Y

Y

Tolerance depth drill

+/-0.1 mm

+/-0.075 mm

+/-0.05 mm

Backdrill diameter

0.50 mm

0.35 mm

0.25 mm

Min. depth of backdrill

0.25 mm

0.20 mm

0.15 mm

Drill depth tolerance

+/-0.2 mm

+/-0.15 mm

0.10 mm

HDI type 2+n+2

Y

Y

Y

Min. laser hole diameter

0.1

0.075

0.065

Microvia Max.aspect ratio

1:1

1:1

1:1

Copper filled microvia

Y

Y

Y

Resin filled microvia

Y

Y

Y

Stacked &Staggered via

Y

Y

Y

Laser via land pad size

Via diameter+0.15 mm

Via diameter+0.125 mm

Via diameter+0.1 mm

Laser via capture pad size

Via diameter+0.25 mm

Via diameter+0.225 mm

Via diameter+0.2 mm

Rigid-flex boards

Y

Y

Y

Min. width between rigid parts

5 mm

3 mm

2 mm

Min. Flex width

5 mm

3 mm

2 mm

Flex boards

Y

Y

Y

IMS boards

Y

Y

Y

Embedded components

N

Y

Y

Soldermask via plugging IPC4761 type VI

Y

Y

Y

Epoxy via plugging IPC4761 type VI

Y

Y

Y