PCB Capabilities
Below is an in-depth list of SprintPCB's PCB capabilities. This table will allow you to better understand our capabilities in order the desired outcome is realised.
Below is an in-depth list of SprintPCB's PCB capabilities. This table will allow you to better understand our capabilities in order the desired outcome is realised.
Feature | Standard | Advanced | R&D |
---|---|---|---|
Layers count | 24 | 32 | 60 |
Minimum board thickness (with solder mask) | 0.6mm | 0.40mm | 0.20mm |
Maximum board thickness | 4mm | 6mm | 10mm |
Minimum board size | 50mm x 50mm | 30mm x 30mm | 5mm x 5mm |
Maximum board size | 600mm x 570mm | 960mm 600mm | 1250mm x 570mm |
Minimum line/space innerlayer (depend on copper weight) | 3mil/3mil | 2.5mil/2.5mil | 2mill/2mil |
Minimum line/space outerlayer (depend on copper weight) | 4mil/4mil | 3mil/3mil | 2mil/2mil |
Surface finish types | OSP, HASL, ENIG, Immersion Silver, Immersion Tin, Hard gold (Connector board) | Hard gold (Selective board) soft gold, ENEPIG | Plus ISIG,EPIG |
Mechanical hole size (Finish hole size) | 0.2 mm | 0.15 mm | 0.1 mm |
Maximum aspect ratio PTH | 10 | 16 | 20 |
Finished tolerance PTH | +/-0.075 mm | +/-0.05 mm | +/-0.025 mm |
Finished tolerance NPTH | +/-0.05 mm | +/-0.025 mm | +/-0.015 |
Epoxy filled through holes (Y/N) | Y | Y | Y |
Capped via (Y/N) | Y | Y | Y |
Maximum copper weight outerlayer | 6 oz | 8 oz | 10 oz |
Maximum copper weight innerlayer | 6oz | 6oz | >6oz |
Control depth drill (Y/N) | Y | Y | Y |
Tolerance depth drill | +/-0.1 mm | +/-0.075 mm | +/-0.05 mm |
Backdrill diameter | 0.50 mm | 0.35 mm | 0.25 mm |
Min. depth of backdrill | 0.25 mm | 0.20 mm | 0.15 mm |
Drill depth tolerance | +/-0.2 mm | +/-0.15 mm | 0.10 mm |
HDI type 2+n+2 | Y | Y | Y |
Min. laser hole diameter | 0.1 | 0.075 | 0.065 |
Microvia Max.aspect ratio | 1:1 | 1:1 | 1:1 |
Copper filled microvia | Y | Y | Y |
Resin filled microvia | Y | Y | Y |
Stacked &Staggered via | Y | Y | Y |
Laser via land pad size | Via diameter+0.15 mm | Via diameter+0.125 mm | Via diameter+0.1 mm |
Laser via capture pad size | Via diameter+0.25 mm | Via diameter+0.225 mm | Via diameter+0.2 mm |
Rigid-flex boards | Y | Y | Y |
Min. width between rigid parts | 5 mm | 3 mm | 2 mm |
Min. Flex width | 5 mm | 3 mm | 2 mm |
Flex boards | Y | Y | Y |
IMS boards | Y | Y | Y |
Embedded components | N | Y | Y |
Soldermask via plugging IPC4761 type VI | Y | Y | Y |
Epoxy via plugging IPC4761 type VI | Y | Y | Y |
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