The multilayer PCB segment is a big part of our production.
What is a multilayer PCB?
A multilayer PCB consists of three or more conductive copper layers, with the conductive foil appearing as various layers of a multi-sided circuit board. The different inner layers are processed in pairs on a core and then bonded together using prepreg as the insulating layer. Both sides of the PCB can be used to mount components with additional tracking and electrical connections on the inside of the board. Vias are used as a source of electrical connections between different layers.
Multilayer PCBs are widely used in various products, including computers, medical equipment, in-car systems, GPS and satellite systems, and industrial control systems.
Number of layers
4 – 22 layers standard, 30 layers advanced, 40 layers prototype.
Multiple layers of epoxy glass fiber bonded together with multiple layers of copper of varying thicknesses.
High performance FR4, halogen-free FR4, low loss and low Dk materials
Copper weights (finished)
18μm – 70μm
Minimum track and gap
0.075mm / 0.075mm
0.40mm – 7.0mm
580mm x 1080mm, advanced 610mm x 1400mm
Surface finishes available
HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers
Minimum mechanical drill
FAQ about Multilayer PCBs
A multilayer PCB is a printed circuit board that consists of multiple layers of conductive material sandwiched between insulating layers. This type of PCB is used for complex electronic circuits that require more space for routing and component placement.
A single-layer PCB only has one layer of conductive material, while a multilayer PCB has multiple layers of conductive material. The multiple layers in a multilayer PCB allow for more space for routing and component placement, making it possible to create more complex circuits.
Some of the benefits of using a multilayer PCB include increased circuit density, improved performance, reduced electromagnetic interference, and reduced circuit size.
The materials used in a multilayer PCB typically include a substrate material, conductive layers (such as copper), insulating layers (such as polyimide or FR4).
Multilayer PCBs are typically manufactured using a process that involves layering, drilling, etching, and laminating. The process starts with the creation of a substrate, followed by the deposition of conductive layers and insulating layers. The layers are then drilled to create vias and holes for component placement. Finally, the board is laminated to ensure stability and durability.
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